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SAM.govRef 80NSSC27946811Q

Dopant Selective Deep Reactive Ion Etching of 4H-SiC Wafer

NNATIONAL AERONAUTICS AND SPACE ADMINISTRATION logo
Contracting officeNational Aeronautics and Space Administration
ClosedSuppliesNAICS 334413
Submission deadlineOct 16, 202605:00 PM EDTClosed
PublishedOct 13, 2026
LocationCleveland, OH
Notice type
Special Notice
Product or service code
5961 · SEMICONDUCTOR DEVICES AND ASSOCIATED HARDWARE
Set-aside
Not specified
Place of performance
OhioCleveland, OH
Official notice
View on SAM.gov ↗

Description

NASA/NSSC has a requirement for Dopant Selective Deep Reactive Ion Etching of 4H-SiC Wafer. See attached SOW for full details of the requirement. VENDORS MUST REFERENCE THE NOTICE ID WHEN SUBMITTING A CAPABILITY STATEMENT.

NOTE: Quotes received in response to this notice will NOT be considered and will not be evaluated by NASA’s Technical End User Team. We are currently only requesting Capability Statements.

The rest of this notice

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