SAM.govRef N0017326P2436

Semiconductor Die Bonding and Vacuum Packaging System

Name: Semiconductor Die Bonding and Vacuum Packaging System
Creator: Department of the Navy
Published: 2026-09-15T21:32:29.000Z
License: https://creativecommons.org/publicdomain/mark/1.0/

Contracting officeDepartment of the Navy

AwardSuppliesNAICS 333993

Contract value$672,985

PublishedSep 15, 2026

LocationWashington, DC

Notice type: Award Notice
NAICS industry: 333993 · Packaging Machinery Manufacturing
Product or service code: 3540 · WRAPPING AND PACKAGING MACHINERY
Set-aside: Not specified
Place of performance: District of ColumbiaWashington, DC
Official notice: View on SAM.gov ↗

Description

This contract is awarded to COOK AND WEIL, INC. under simplified procedures for certain commercial items included in FAR subpart 13.5 for Semiconductor Die Bonding and Vaccuum Packaging System.

The rest of this notice

The buyer's named contact and the award details for this notice are free. Create an account to open the full record.

Contact the buyer directly
See who won, and for how much
Get alerts for opportunities like this one

Create a free account

Free — no card, no trial clock.

Get new Packaging Machinery Manufacturing contracts by email — free, no card needed.

Create a free alert